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INTEGRATED CIRCUITS
DATA SHEET
CGY2032TS DECT 500 mW power amplifier
Product specification Supersedes data of 1998 Nov 23 File under Integrated Circuits, IC17 1999 Jul 21
Philips Semiconductors
Product specification
DECT 500 mW power amplifier
FEATURES * Power Amplifier (PA) overall efficiency 55% * 27.5 dBm saturated output power at 3.2 V * 0 dBm input power * 40 dB linear gain * Operation without negative supply * Wide operating temperature range -30 to +85 C * SSOP16 package. APPLICATIONS
CGY2032TS
* 1.88 to 1.9 GHz transceivers for DECT applications * 2 GHz transceivers [Personal Handy phone System (PHS), Digital Cellular System (DCS) and Personal Communication Services (PCS)]. GENERAL DESCRIPTION The CGY2032TS is a GaAs Monolithic Microwave Integrated Circuit (MMIC) power amplifier specifically designed to operate from 3.6 V battery supply. No negative supply voltage is required for operation.
QUICK REFERENCE DATA SYMBOL VDD IDD Po Tamb Note 1. For conditions, see Chapters "AC characteristics" and "DC characteristics". ORDERING INFORMATION TYPE NUMBER CGY2032TS PACKAGE NAME SSOP16 DESCRIPTION plastic shrink small outline package; 16 leads; body width 4.4 mm VERSION SOT369-1 positive supply voltage positive peak supply current output power ambient temperature PARAMETER(1) MIN. - - - -30 TYP. 3.2 350 27.5 - MAX. - - - +85 UNIT V mA dBm C
BLOCK DIAGRAM
handbook, halfpage
VDD1 8
VDD2 VDD3 5 1
CGY2032TS
RFI 11 16 15 10 GND1 6, 7 2, 3, 4 12, 13, 14
MGK735
RFO OPM
GND2 GND3
Fig.1 Block diagram.
1999 Jul 21
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Philips Semiconductors
Product specification
DECT 500 mW power amplifier
PINNING SYMBOL VDD3 GND3 GND3 GND3 VDD2 GND2 GND2 VDD1 n.c. GND1 RFI GND3 GND3 GND3 OPM RFO PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION third stage supply voltage third stage ground supply third stage ground supply third stage ground supply second stage supply voltage second stage ground supply second stage ground supply first stage supply voltage not connected first stage ground supply PA input third stage ground supply third stage ground supply third stage ground supply output pre-matching PA output
GND3 4
handbook, halfpage
CGY2032TS
VDD3 1 GND3 2 GND3 3
16 RFO 15 OPM 14 GND3 13 GND3
CGY2032TS
VDD2 5 GND2 6 GND2 7 VDD1 8
MGK734
12 GND3 11 RFI 10 GND1 9 n.c.
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION Amplifier The CGY2032TS is a 3-stage GaAs power amplifier capable of delivering 500 mW (typ.) at 1.9 GHz into a 50 load. Each amplifier stage has an open-drain configuration. The drains have to be loaded externally by adequate reactive circuits which must also provide a DC path to the supply. The amplifier can be switched off by means of a single external PNP or PMOS series switch connected between the battery and the amplifier drains.
This switch can also be used to vary the actual supply voltage applied to the amplifier and hence, control the output power. This device is specifically designed to work with a duty factor of 50% and can work up to 100% with good thermal performance printed-circuit boards. Biasing Internal biasing is provided inside the amplifier for class AB operation.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Tj(max) Ptot Pi Tstg Notes 1. On Philips evaluation board. 2. On Philips evaluation board, Ptot maximum value is 800 mW. PARAMETER operating supply voltage maximum operating junction temperature total power dissipation input power storage temperature note 2 CONDITIONS note 1 - - - - -55 MIN. MAX. 5.2 150 450 15 +125 V C mW dBm C UNIT
1999 Jul 21
3
Philips Semiconductors
Product specification
DECT 500 mW power amplifier
HANDLING
CGY2032TS
Do not operate or store near strong electrostatic fields. Meets class 1 ESD test requirements [Human Body Model (HBM)], in accordance with "MIL STD 883C - method 3015". THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note 1. On Philips evaluation board, Rth(j-a) value is typically 80 K/W. DC CHARACTERISTICS Tamb = 25 C; unless otherwise specified. SYMBOL Pins VDD1, VDD2 and VDD3 VDD IDD positive supply voltage positive peak supply current VDD = 3.2 V 1.8 - 3.2 - 4.2 800 V mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT PARAMETER thermal resistance from junction to ambient CONDITIONS in free air; note 1 VALUE 145 UNIT K/W
AC CHARACTERISTICS VDD = 3.2 V; fRF = 1900 MHz; Pi = 0 dBm; Tamb = 25 C; duty factor = 50%; 50 impedance system; measured and guaranteed on the CGY2032TS evaluation board; the circuit diagram is shown in Fig.5. SYMBOL Pi Po IDD Pleak H2 H3 Stab Note 1. The device is adjusted to provide nominal value of load power into a 50 load. The device is switched off and a 6 : 1 load replaces the 50 load. The device is switched on and the phase of the 6 : 1 load is varied 360 electrical degrees during a 60 seconds test period. input power duty factor output power total drain current efficiency RF leakage to output in power off state second harmonic level third harmonic level stability (spurious levels) note 1 VDD = 0 V PARAMETER CONDITIONS MIN. -5 - 26.5 - - - - - - TYP. 0 50 27.5 - 55 -40 - - -60 MAX. +5 100 29 500 - -35 -30 -35 - UNIT dBm % dBm mA % dBm dBc dBc dBc
1999 Jul 21
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Philips Semiconductors
Product specification
DECT 500 mW power amplifier
CGY2032TS
handbook, full pagewidth
30
FCA009
100
Po (dBm) 26
power output
(%) 80
22 efficiency
60
18
40
14
20
10 -20
-15
-10
-5
0 0 5 Pi (dBm) 10
Fig.3 Typical output power and efficiency versus input power at VDD = 3.2 V.
handbook, full pagewidth
30
MGK738
100
Po (dBm) 26
(%) power output 80
22 efficiency
60
18
40
14
20
10 0 0.5 1 1.5 2 2.5 3 3.5 VDD (V) 4
0 4.5
Fig.4 Typical output power and efficiency versus supply voltage at Pi = 0 dBm.
1999 Jul 21
5
Philips Semiconductors
Product specification
DECT 500 mW power amplifier
APPLICATION INFORMATION
CGY2032TS
The CGY2032TS is operated and tested in accordance with the circuit diagram shown in Fig.5. Supply voltage switching is achieved by a single bipolar PNP transistor.
handbook, full pagewidth
Vbat 10 F 10 k control 6.8 pF 47 k BC849C
220 BC807 VDD 10 nF 33 pF 22 pF 6.8 pF
TRL1(1) VDD1 8 RFI 11 5
TRL2(2) VDD2 1
TRL3(3) VDD3
CGY2032TS
10 GND1 6, 7 GND2 2, 3, 4 12, 13, 14 GND3 15 OPM
RFO 16 1.2 pF
TRL4(4)
MGK736
Thickness: 0.8 mm; substrate: FR4; r = 4.7. (1) TRL1: width = 500 m; length = 10 mm. (2) TRL2: width = 500 m; length = 3000 m. (3) TRL3: width = 500 m; length = 7 mm. (4) TRL4: adjusted for optimum matching; width = 500 m; length = 1 to 3 mm.
Fig.5 Evaluation board circuit diagram.
1999 Jul 21
6
Philips Semiconductors
Product specification
DECT 500 mW power amplifier
PACKAGE OUTLINE SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm
CGY2032TS
SOT369-1
D
E
A X
c y HE vM A
Z
16
9
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0.00 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.25 0.13 D (1) 5.30 5.10 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT369-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 94-04-20 95-02-04
1999 Jul 21
7
Philips Semiconductors
Product specification
DECT 500 mW power amplifier
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
CGY2032TS
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Jul 21
8
Philips Semiconductors
Product specification
DECT 500 mW power amplifier
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable
CGY2032TS
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Jul 21
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Philips Semiconductors
Product specification
DECT 500 mW power amplifier
NOTES
CGY2032TS
1999 Jul 21
10
Philips Semiconductors
Product specification
DECT 500 mW power amplifier
NOTES
CGY2032TS
1999 Jul 21
11
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
465008/04/pp12
Date of release: 1999
Jul 21
Document order number:
9397 750 05971

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